to be developed Electronic packaging is a vital part in the physical realization of electronic systems. The course focuses on recent developments in the area of electronic packaging. Fundamental academic knowledge in the area of joining technologies and packaging materials will be one part of the lecture. Other chapters include area array components, stacked chips, system in package and green packaging technologies.


- Background of high pin counts
- Electrical and Thermal Issues in Electronic Packaging
- Specific Surfaces and Joining Technologies
- Area Array Components
- Bumping Technologies and Flip‐Chip‐Packages
- From Ball Grid Array Packages to Chip Size Packages
- Chip Stacking and other System in Package approaches
- Green Packaging Technologies