Advanced Electronic Packaging / Aufbau- und Verbindungstechnik II


Prof. Dr.-Ing. habil. Steffen Wiese


Aims / Competences to be developed

Based on selected publications from international journals or chapters from specialist books current developments in advanced electronic packaging, fundamental material-physical mechanisms in connection systems are to be presented in a lecture and discussed among the seminar participants. The aim of the event is to deal with topics beyond basic education as well as acquire skills in the presentation of scientific-technical issues.


The content and sequence of the seminars will be determined at the beginning of the semester.