Advanced Electronic Packaging / Aufbau- und Verbindungstechnik 2
Lecturer
Prof. Dr.-Ing. habil. Steffen Wiese
Aims / Competences to be developed
Based on selected publications from international journals or chapters from specialist books current developments in advanced electronic packaging, fundamental material-physical mechanisms in connection systems are to be presented in a lecture and discussed among the seminar participants. The aim of the event is to deal with topics beyond basic education as well as acquire skills in the presentation of scientific-technical issues.
Content
The content and sequence of the seminars will be determined at the beginning of the semester.
Downloads
Exercise 1 04.05.
Exercise 2 01.06.
Exercise 3 08.06.
Exercise 4 15.06./ 22.06./ 29.06
Exercise 5 15.06./22.06./ 29.06.
Exercise 6 06.07.
Exercise 7 13.07.
Lecture
- 135046 -
Wed 12-14, Campus A5 1, room -1.22
13.04. - 20.07. weekly
Exercise
Wed 14-15, Campus A5 1, room -1.22
n.n. weekly