Advanced Electronic Packaging / Aufbau- und Verbindungstechnik II


Prof. Dr.-Ing. habil. Steffen Wiese


Wenn Sie an der Vorlesung teilnehmen möchten, registrieren Sie sich bitte per Email bei Herrn Dr. Andreas Ruh.

Wichtig: Bitte benutzen Sie dabei Ihre Uni-Email-Adresse. Machen Sie bei Anmeldung bitte folgende Angaben:

Name und Matrikelnummer

Aims / Competences to be developed

Based on selected publications from international journals or chapters from specialist books current developments in advanced electronic packaging, fundamental material-physical mechanisms in connection systems are to be presented in a lecture and discussed among the seminar participants. The aim of the event is to deal with topics beyond basic education as well as acquire skills in the presentation of scientific-technical issues.


The content and sequence of the seminars will be determined at the beginning of the semester.


Exercise 1  10.05.

Exercise 2  31.05