Advanced Electronic Packaging / Aufbau- und Verbindungstechnik II

Participation

If you would like to attend the lecture, please register by sending an email to Ms. Vera Winterhalder.

Important: Please use your university e-mail address. Please provide the following information when registering:

Name
Matriculation number
Number of semesters
Area of specialisation

Lecturer

Prof. Dr.-Ing. habil. Steffen Wiese

Aims / Competences to be developed

Based on selected publications from international journals or chapters from specialist books current developments in advanced electronic packaging, fundamental material-physical mechanisms in connection systems are to be presented in a lecture and discussed among the seminar participants. The aim of the event is to deal with topics beyond basic education as well as acquire skills in the presentation of scientific-technical issues.

Content

Background of high pincounts
Electrical and Thermal Issues in Electronic Packaging
Specific Surfaces and Joining Technologies
Area Array Components
Bumping Technologies and Flip-Chip-Packages
From Ball Grid Array Packages to Chip Size Packages
Chip Stacking and other System in Package approaches
Green Packaging Technologies

Lecture

155919
Wednesday, 12:00 - 14:00 h
09.04.2025 - 16.07.2025
Building A5 1, room -1.22 (lecture hall II)
Prof. Dr.-Ing. habil. Steffen Wiese

Introduction: Wed. 09.04.2025 12:00 Uhr

Exercise

155919
Wednesday, 14:00 - 15:00 h
09.04.2025 - 16.07.2025
Building A5 1, room -1.22 (lecture hall II)
Prof. Dr.-Ing. habil. Steffen Wiese

Exercise 1:

Exam

Please note that it is necessary to register for this exam at least one week before the date via your log-in. If that is not possible please sign in at the exam secretariat:

Gemeinsames Prüfungssekretariat der NTF der UdS
Gebäude E1 3, Raum 202
Telefon: +49 (0) 681 302 5003

Tasks are solved on exercise sheets provided by the chair
Calculators are provided (CASIO FX-82Solar II)
Exercise sheets must be completed in ink