Advanced Electronic Packaging / Aufbau- und Verbindungstechnik 2

Aims / Competences to be developed

Based on selected publications from international journals or chapters from specialist books current developments in advanced electronic packaging, fundamental material-physical mechanisms in connection systems are to be presented in a lecture and discussed among the seminar participants. The aim of the event is to deal with topics beyond basic education as well as acquire skills in the presentation of scientific-technical issues.

Content

The content and sequence of the seminars will be determined at the beginning of the semester.

Downloads

Exercise 1  04.05.

Exercise 2  01.06.

Exercise 3  08.06.

Exercise 4  15.06./ 22.06./ 29.06

Exercise 5 15.06./22.06./ 29.06.

Exercise 6  06.07.

Exercise 7  13.07.

Lecture

- 135046 -
Wed 12-14, Campus A5 1, room -1.22
13.04. - 20.07. weekly

Exercise

Wed 14-15, Campus A5 1, room -1.22
n.n.  weekly