Design for Reliability for Electronic Systems / Zuverlässigkeit II


If you would like to attend the lecture, please register by sending an email to Ms. Vera Winterhalder.

Important: Please use your university e-mail address. Please provide the following information when registering:

  • Name
  • Matriculation number
  • Number of semesters
  • Area of specialisation 


Prof. Dr.-Ing. habil. Steffen Wiese

Aims/Competences to be developed

Design for Reliability encompasses conceptual activities that address the reliability of electronic packages and systems. The major part of failures in electronic assemblies can be related to thermal-mechanical stresses. In order to understand this specific nature of failures, the lecture focuses on physics of failure. The first part will deal with the structure, deformation behavior and damage of materials. The second part deals with material modeling and FEM-simulation, in order to analyze thermal-mechanical stresses in electronic assemblies


  • Background of thermal mechanical damage processes
  • Driving forces for thermal-mechanical stresses
  • Structure of materials in micro- and macro-dimensions
  • Non-linear deformation behavior of materials (time- and temperature dependence)
  • Damage behavior of materials
  • Material modeling
  • FEM-simulation
  • Lifetime assessment


Wednesday, 10:00 - 12:00 Uhr
17.04.2024 - 24.07.2024
Building A5 1, Room -1.22 (Lecture halll II)
Prof. Dr.-Ing. habil. Steffen Wiese


Wednesday 15:00 -16:00 h
Building A5 1, Room -1.22 (Lecture hall II)
Prof. Dr.-Ing. habil. Steffen Wiese


Term will be announced

Please note that it is necessary to register for this exam at least one week before the date via your log-in. If that is not possible please sign in at the exam secretariat:

Gemeinsames Prüfungssekretariat der NTF der UdS
Gebäude E1 3, Raum 202
Telefon: +49 (0) 681 302 5003


  • Tasks are solved on task sheets provided by the chair
  • Calculators are provided (CASIO FX-82Solar II)
  • Task sheets must be filled in with non-erasable writing material